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Core Technologies
HDI Substrate Technology
HDI (High Density Interconnect) Substrate Technology:
Gennum's HDI substrate technology utilizes a combination of thick and thin film processing techniques coupled with specialized thick film materials to fabricate high density high performance ceramic based substrate circuits. By combining processes a high degree of flexibility is obtained allowing a wide variety of circuits to be fabricated in the most cost effective manner. The high precision features that are achieved improve downstream assembly efficiences while the high density circuitry supports even the most complex MCM designs and fine pitch assembly processes.
Some HDI Basics:
HDI circuitry can be fabricated on a variety of ceramics including 92%, 96%, 99% Al2O3, and AlN. The specialized thick film materials that are used offer excellent high speed performance. High density conductor and dielectric layers are used to form multi-layer double sided circuit structures. Integration of thick film resistor and inductor elements within the circuit are also possible.
High frequency performance of HDI gold conductors:
High frequency perfomance of filled through holes:
Please contact us regarding any questions about our HDI substrate technology and what it is capable of doing for you (also see Multi-Layer HDI Substrates) |
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