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| Substrate Material
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Al2O3: 92%, 96%, 99+% AlN
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| Substrate Thickness
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as required (typically 250um - 625um [0.010" - 0.025"])
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| Through Hole Size
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down to 125um
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| Through Hole Connections
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solid filled through holes edge coated through holes
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| Thick Film Materials:
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Au, Ag/Pd, Ag/Pt, Cu (others available upon request)
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| Thick Film Printed Line Resolution
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100 um [0.004"] track and space
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| Etched Thick Film Line Resolution
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25 um [0.001"] track and space (+/- 5um)
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| Dielectric Via Size
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50 um [0.002"] minimum
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Thick Film Resistors
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Laser Trimming - passive & active trimming
Range of Values - 2.5ohm to 20Mohm
Tolerance - .5% (absolute), 0.1% (ratio)
Temp. Coefficient - +/- 50 ppm/ °C
Stability - better than 4%
Power Dissipation 100W/in²
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| Scribing and Sawing
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scribing and precision dicing
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| Trace-ability
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laser marking to provide work order trace-ability
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| Design
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fully feasibility and detailed design capability / support
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| Design Exchange Formats
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Gerber, DXF, Allegro, GDSII
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| Testing
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fully automated
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HDI circuitry can be fabricated on a variety of ceramics including 92%, 96%, 99% Al2O3, and AlN. Two sided functionality is achieved by laser machining thru holes and then filling them with a metal paste to create electrical paths that connect circuitry on one side of the substrate to the other. High density circuitry (down to 25um lines/spaces) is accomplished through screen printing specialized thick films onto the substrate and then patterning utilizing photolithography and wet etching processes. Gold and silver based conductors are available. Multi-layer circuitry on either or both sides of the substrate is achieved using patented photosensitive thick film dielectrics capable of producing interconnect vias down to 50um diameter. Traditional printed thick film layers can be incorporated at any process stage where appropriate. Controlled impedance structures along with thick film resistor and inductor elements can also be integrated into the circuit design.
