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Technical Papers
BST Capacitors
Barium Strontium Titanate Thin-Film Multi- Layer Capacitors
Thomas A. Bernacki, Ivoyl P. Koutsaroff and Charles Divita
Passive Component Industry Magazine, September/October 2004
 PDF (544kb)
Feasibility demonstration of a multi-level thin film BST capacitor technology
Watt M.M., Woo P., Rywak T., McNeil L., Kassam A., Joshi V., Cuchiaro J.D., Melnick, B.M., ISAF 98. Proceedings of the Eleventh IEEE International Symposium on Applications of Ferroelectrics, 24-27 Aug. 1998, pp. 11 - 14 (1998).
PDF (160kb)
Microwave properties of Parallel Plate Capacitors based on (Ba,Sr)TiO3 thin films grown on SiO2/Al2O3 substrates
Koutsaroff I.P., Bernacki T., Zelner M., Cervin-Lawry A., Kassam A., Woo P., Woodward L., Patel A., Materials Research Society, Symposium Proceeding 784, Ferroelectrc Thin Films XII, Editors: Hoffmann-Eifert S., Funakubo H., Joshi V., Kingon A.I., Koutsaroff I.P., pp. 319-325 (2004).
PDF (768kb)
Dielectric properties of (Ba,Sr) TiO3 MOD films grown on various substrates
Koutsaroff I.P., Woo P., McNeil L., Zelner M., Kassam A., Capanu M., Chmiel L., McClelland B., Cervin-Lawry A., ISAF 2002: Proceedings of the 13th IEEE International Symposium on Applications of Ferroelectrics, Editors: White G., Tsurumi T., pp. 247-250, (2002).
PDF (578kb)
Dielectric properties of (Ba,Sr) TiO3 thin film capacitors fabricated on alumina substrates
Koutsaroff I.P., Kassam A., Zelner M., Woo P., McNeil L., Bernacki T., Cervin-Lawry A., Patel A., Materials Research Society Symposium Proceeding 748, Ferroelectrc Thin Films, Editors: Kaufman D.Y., Hoffmann-Eifert S., Gilbert S.R., Aggarwal S., Shimizu M., pp. 413-422 (2003).
PDF (1.8mb)
HDI Substrates
HDI Controlled Impedance Structures
PDF (64mb)
High Density Thick Film Substrates for Miniaturized 3D Chip Stacking Packaging Solutions
Mark Vandermeulen, David Roy, Sam Pirritano, Thomas Bernacki, Charles Divita,
Ivo Koutsaroff, Sukhi Binapal
PDF (1mb)
Copyright ©, 2001 by IMAPS - International Microelectronics And Packaging Society. Reprinted with permission from the 37th International Symposium on Microelectronics Proceedings CD-ROM, Long Beach, California, November 14-18, 2004.
Packaging Solutions
Development of a miniature bluetooth module for manufacturability using a system-in-package approach
Cervin-Lawry A., Ali K., Bernacki T., Binapal S., Miortescu C., Patel A., Woo P., Woodward L. Ceramic Interconnect Technology: Next Generation.
PDF (256kb)
Innovative Thick Film Packaging Solution for Next Generation Hearing Aid
PDF (64kb)
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